Bulletins

India opens Semicon 2.0 applications for materials, fabs and chip packaging

The government opened applications under three Semicon 2.0 pillars covering machinery and materials, fabs and chip packaging, and separately announced 12 electronics-components applicants approved under another scheme.

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01 / 03

India and EU conclude negotiations for Indian association with Horizon Europe

India and the EU have concluded negotiations on association with Horizon Europe, which could widen Indian participation in European research calls. Completion of talks is not the same as membership taking legal effect.

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01 / 01